Altium

Design Rule Verification Report

Date: 9/5/2023
Time: 8:16:32 AM
Elapsed Time: 00:00:01
Filename: Z:\APPLICATION\BOARDS\MEMS Adapter DIL24\ACC_GYRO\MS 3A3G SW\MS 3A3G SW No resistors\MS 3A3G SW S_IC\STEVAL\MKI243A\MKI243A.PcbDoc
Warnings: 0
Rule Violations: 11

Summary

Warnings Count
Total 0

Rule Violations Count
Clearance Constraint (Gap=0.2mm) (All),(All) 0
Short-Circuit Constraint (Allowed=No) (All),(All) 0
Un-Routed Net Constraint ( (All) ) 0
Width Constraint (Min=0.15mm) (Max=5mm) (Preferred=0.2mm) (All) 0
Power Plane Connect Rule(Relief Connect )(Expansion=0.508mm) (Conductor Width=0.4mm) (Air Gap=0.3mm) (Entries=4) (All) 0
Hole Size Constraint (Min=0.025mm) (Max=2.54mm) (All) 0
Hole To Hole Clearance (Gap=0.254mm) (All),(All) 0
Minimum Solder Mask Sliver (Gap=0.254mm) (All),(All) 8
Silk To Solder Mask (Clearance=0.15mm) (IsPad),(All) 2
Silk to Silk (Clearance=0.2mm) (All),(All) 1
Net Antennae (Tolerance=0mm) (All) 0
Height Constraint (Min=0mm) (Max=25.4mm) (Prefered=12.7mm) (All) 0
Total 11

Minimum Solder Mask Sliver (Gap=0.254mm) (All),(All)
Minimum Solder Mask Sliver Constraint: (0.007mm < 0.254mm) Between Pad U1-1(7.058mm,-13.22mm) on Top Layer And Pad U1-14(7.718mm,-13.045mm) on Top Layer [Top Solder] Mask Sliver [0.007mm]
Minimum Solder Mask Sliver Constraint: (0.023mm < 0.254mm) Between Pad U1-10(9.378mm,-13.72mm) on Top Layer And Pad U1-12(8.718mm,-13.045mm) on Top Layer [Top Solder] Mask Sliver [0.023mm]
Minimum Solder Mask Sliver Constraint: (0.007mm < 0.254mm) Between Pad U1-11(9.378mm,-13.22mm) on Top Layer And Pad U1-12(8.718mm,-13.045mm) on Top Layer [Top Solder] Mask Sliver [0.007mm]
Minimum Solder Mask Sliver Constraint: (0.023mm < 0.254mm) Between Pad U1-14(7.718mm,-13.045mm) on Top Layer And Pad U1-2(7.058mm,-13.72mm) on Top Layer [Top Solder] Mask Sliver [0.023mm]
Minimum Solder Mask Sliver Constraint: (0.023mm < 0.254mm) Between Pad U1-3(7.058mm,-14.22mm) on Top Layer And Pad U1-5(7.718mm,-14.895mm) on Top Layer [Top Solder] Mask Sliver [0.023mm]
Minimum Solder Mask Sliver Constraint: (0.007mm < 0.254mm) Between Pad U1-4(7.058mm,-14.72mm) on Top Layer And Pad U1-5(7.718mm,-14.895mm) on Top Layer [Top Solder] Mask Sliver [0.007mm]
Minimum Solder Mask Sliver Constraint: (0.007mm < 0.254mm) Between Pad U1-7(8.718mm,-14.895mm) on Top Layer And Pad U1-8(9.378mm,-14.72mm) on Top Layer [Top Solder] Mask Sliver [0.007mm]
Minimum Solder Mask Sliver Constraint: (0.023mm < 0.254mm) Between Pad U1-7(8.718mm,-14.895mm) on Top Layer And Pad U1-9(9.378mm,-14.22mm) on Top Layer [Top Solder] Mask Sliver [0.023mm]
Back to top

Silk To Solder Mask (Clearance=0.15mm) (IsPad),(All)
Silk To Solder Mask Clearance Constraint: (0.025mm < 0.15mm) Between Pad C1-1(8.871mm,-22.937mm) on Top Layer And Track (8.346mm,-23.887mm)(8.346mm,-22.013mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.025mm]
Silk To Solder Mask Clearance Constraint: (0.025mm < 0.15mm) Between Pad C1-2(10.571mm,-22.937mm) on Top Layer And Track (11.095mm,-23.887mm)(11.095mm,-22.038mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.025mm]
Back to top

Silk to Silk (Clearance=0.2mm) (All),(All)
Silk To Silk Clearance Constraint: (0.187mm < 0.2mm) Between Text "STEVAL$MKI243AA" (1.588mm,-26.905mm) on Top Overlay And Track (1.201mm,-27.352mm)(1.201mm,-25.544mm) on Top Overlay Silk Text to Silk Clearance [0.187mm]
Back to top